发明名称 SEMICONDUCTOR MODULE AND ELECTRICALLY-DRIVEN VEHICLE
摘要 A semiconductor module includes a first semiconductor element, a second semiconductor element, a first heat spreader electrically and thermally connected to the first semiconductor element, a second heat spreader electrically and thermally connected to the second semiconductor element, a DCB substrate including a first metal foil on a top surface of a ceramic insulating substrate and including a second metal foil on a bottom surface, the first metal foil being electrically and thermally joined to the first heat spreader and the second heat spreader, and a cooler thermally connected to the second metal foil of the DCB substrate. The first semiconductor element is disposed on an upstream side, and the second semiconductor element is disposed on a downstream side with respect to a flowing direction of a refrigerant of the cooler. An area of the second heat spreader is greater than an area of the first heat spreader.
申请公布号 US2016099194(A1) 申请公布日期 2016.04.07
申请号 US201514968253 申请日期 2015.12.14
申请人 FUJI ELECTRIC CO., LTD. 发明人 GOHARA Hiromichi;ARAI Nobuhide;ADACHI Shinichiro;NISHIMURA Yoshitaka
分类号 H01L23/373;H01L23/473;H01L23/467 主分类号 H01L23/373
代理机构 代理人
主权项 1. A semiconductor module, comprising: a first semiconductor element; a second semiconductor element; a first heat spreader electrically and thermally connected to a bottom surface of the first semiconductor element; a second heat spreader electrically and thermally connected to a bottom surface of the second semiconductor element; a DCB substrate including a ceramic insulating substrate, a first metal foil disposed on a top surface of the ceramic insulating substrate to electrically and thermally join to a bottom surface of the first heat spreader and a bottom surface of the second heat spreader, and a second metal foil disposed on a bottom surface of the ceramic insulating substrate; and a cooler thermally connected to the second metal foil of the DCB substrate, wherein the first semiconductor element is disposed on an upstream side and the second semiconductor element is disposed on a downstream side with respect to a flowing direction of a refrigerant of the cooler, and an area of the second heat spreader is greater than an area of the first heat spreader.
地址 Kawasaki-shi JP