| 摘要 |
Provided are a curable resin composition with excellent heat resistance, a dry film, cured product, and a printed circuit board comprising the cured product. According to the present invention, it is possible to obtain a curable resin composition containing a curable resin and a colorant represented by chemical formula 1. In the chemical formula 1, R1 and R2 refer to an alkyl group respectively, and m and n are one of integers from 0 to 6. |
