| 摘要 |
This semiconductor manufacturing apparatus is provided with: a chamber for housing a substrate holder having a substrate mounted thereon; a heating apparatus, which is disposed in the chamber, and which heats the substrate mounted on the substrate holder; an external heat insulating material, which is formed of an inorganic material having a structure wherein an inner material is wrapped with a fiber-woven cloth-like external material, said inorganic material not containing an organic additive, and which is disposed to cover the inner wall of the chamber; and an external heat reflecting plate that is disposed on an external insulating material surface facing the heating apparatus. |
