| 摘要 |
The present invention relates to an adhesive composition for a double-sided adhesive sheet, a double-sided adhesive sheet, and a method for manufacturing an embedded printed circuit board package using the same. More specifically, the present invention relates to an adhesive composition for a double-sided adhesive sheet not needing an attachment and detachment process of the adhesive sheet, being capable of embedded printed circuit board packaging by a single insulation layer lamination process, reducing process costs and time, and increasing yield. The present invention also relates to a double-sided adhesive sheet, and to a method for manufacturing an embedded printed circuit board package using the same. The adhesive composition for a double-sided adhesive sheet comprises a polyurethane urea resin, an epoxy curing agent, a thermoplastic resin, and an inorganic filler. |
