High-speed wireless serial communication link for a stacked device configuration using near field coupling

摘要

A memory module houses stacked memory devices and a memory controller each having a near-field interface coupled to loop antennas to communicate over-the-air data. A coil is formed on a memory device substrate or molded into a plastic mold to create near-field magnetic coupling with the stacked memory devices and the memory controller.

主权项

1. A memory module including a package, the package to house multiple memory devices, the memory module comprising:
a memory controller formed in the package and having a loop antenna to transmit over-the-air data; and a first memory device and a second memory device each formed in the package and each having a near-field interface coupled to one or more loop antennas to receive the over-the-air data from the memory controller, the first memory device and the second memory device each being further configured to communicate with each other directly via radio-frequency wireless signals in the near-field through the respective one or more loop antennas.