| 摘要 |
PROBLEM TO BE SOLVED: To inhibit the occurrence of cracks in a mold member and improve heat radiation performance in an electronic device formed by sealing an electronic element with the mold member.SOLUTION: An electronic device S1 includes: an electronic element 10; and a mold member 30 formed by a resin 30a and an insulative filler 30b distributed in the resin 30a and having heat conductivity larger than that of the resin 30a, the mold member 30 sealing the electronic element 10. The filler 30b is exposed to form a surface of the mold member 30 into an uneven surface 33 that forms an uneven shape corresponding to an outer shape of the exposed filler 30b.SELECTED DRAWING: Figure 2 |
