PRESSURE REDUCTION DRYER, SUBSTRATE TREATMENT DEVICE AND PRESSURE REDUCTION DRYING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a technology in which a pressure reduction treatment is performed at a pressure reduction speed closer to a desired pressure reduction speed at a pressure reduction drying device.SOLUTION: This pressure reduction drying device 1 is operated in such a way that a substrate G adhered with treatment liquid is stored in a chamber 20 so as to dry the substrate G by reducing the pressure in the chamber 20. The pressure reduction drying device 1 includes a chamber 20 for storing the substrate G; pressure reduction discharging means 30; a valve 45 for adjusting a flow rate of pressure reduction discharged gas; learning means 80 for obtaining a pressure reduction curved line data in the chamber 20; inputting means 70 into which a target pressure value and a target reaching time are inputted; and a control part 60 for controlling a degree of opening of the valve 45. The control part 60 obtains the reduction pressure curved line data under installation environment of applied chamber 20 and adjusts a degree of opening of the valve 45 on the basis of the reduction pressure curved line data, the target pressure value and the target reaching time. With this arrangement, it is possible to perform the reduction pressure treatment at a reduction pressure speed closer to a desired reduction pressure speed irrespective of an individual difference of the device and the installation environment.SELECTED DRAWING: Figure 2