| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component device that reduces positional variation in bonding in an electrode pad of a semiconductor chip.SOLUTION: The electronic component device includes: a substrate 101 with a round-shape recess; and the electrode pad 102 formed along the recess, where FAB (Free Air Ball) is guided by the recess at formation of a bump and the bump can be formed at an alignment position, thus accuracy of position is enhanced.SELECTED DRAWING: Figure 4 |
