发明名称 LIGHT EMITTING DIODE PACKAGE, LIGHTING MODULE AND BACKLIGHT UNIT INCLUDING THE SAME
摘要 The present invention discloses a light emitting diode package, and a lighting module and a backlight unit including the same. According to the present invention, the light emitting diode package comprises: a light emitting diode chip that generates light; a body part that receives the light emitting diode chip therein; first and second lead frames spaced apart from each other in the body part and electrically connected with the light emitting diode chip, wherein the first lead frame has first and second anode leads and the second lead frame has first and second cathode leads; and first and second dummy lead frames electrically insulated from and spaced apart from the first and second lead frames, respectively. According to the light emitting diode package, and the lighting module and the backlight unit including the same of the present invention, a plurality of light emitting diode packages can be arranged on a printed circuit board and connected with each other using wires formed in the light emitting diode packages without mutual interference between the adjacent light emitting diode packages. Accordingly, the width of the printed circuit board in the lighting module can be reduced, and the manufacturing costs of the lighting module can be saved.
申请公布号 KR20160035711(A) 申请公布日期 2016.04.01
申请号 KR20140127149 申请日期 2014.09.23
申请人 LG DISPLAY CO., LTD. 发明人 LEE, DONG HUN
分类号 H01L33/62 主分类号 H01L33/62
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