| 发明名称 |
PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE HAVING THE SAME |
| 摘要 |
Disclosed are a printed circuit board and an electronic component package having the printed circuit board, which includes: a base board; a heat-dissipating pad formed on the based board and having an electronic component installed thereon; and a bridging pad formed on the base board between the heat-dissipating pad and a shield can installed on the base board so as to allow heat generated by the electronic component to be transferred from the heat-dissipating pad to the shield can. |
| 申请公布号 |
US2016095249(A1) |
申请公布日期 |
2016.03.31 |
| 申请号 |
US201514672770 |
申请日期 |
2015.03.30 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM Hyoung |
| 分类号 |
H05K7/20;H05K1/02 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component package comprising:
a base board; a heat-dissipating pad formed on the base board; an electronic component installed on the heat-dissipating pad; a shield can installed on the base board so as to cover the electronic component; and a bridging pad formed on the base board between the heat-dissipating pad and the shield can so as to allow heat generated by the electronic component to be transferred from the heat-dissipating pad to the shield can. |
| 地址 |
Suwon-si KR |
