SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

摘要

According to one embodiment, a substrate processing apparatus includes a first liquid supplier, a second liquid supplier, and a controller. The first liquid supplier supplies a substrate with a sulfuric acid solution having a first temperature equal to or higher than the boiling point of hydrogen peroxide water. The second liquid supplier supplies a surface to be treated of the substrate with a mixture of sulfuric acid solution and hydrogen peroxide water having a second temperature lower than the first temperature. The controller controls the first liquid supplier to supply the sulfuric acid solution so as to heat the substrate to the boiling point of hydrogen peroxide water or higher. When the temperature of the substrate becomes equal to or higher than the second temperature, the controller controls the first liquid supplier to stop supplying the sulfuric acid solution and controls the second liquid supplier to supply the mixture.

主权项

1. A substrate processing apparatus comprising:
a first liquid supplier configured to supply a substrate with a sulfuric acid solution having a first temperature that is equal to or higher than a boiling point of hydrogen peroxide water; a second liquid supplier configured to supply a surface to be treated of the substrate with a mixture of sulfuric acid solution and hydrogen peroxide water, the mixture having a second temperature that is lower than the first temperature; and a controller configured to control the first liquid supplier to supply the sulfuric acid solution having the first temperature so as to heat the substrate to the boiling point of hydrogen peroxide water or higher, and, when temperature of the substrate becomes equal to or higher than the second temperature, control the first liquid supplier to stop supplying the sulfuric acid solution having the first temperature and control the second liquid supplier to supply the mixture having the second temperature.