PACKAGE STUCTURE AND METHOD OF FABRICATING THE SAME

摘要

A method of fabricating a package structure is provided. The method includes providing a carrier having two opposing surfaces, forming dielectric bodies on the two surfaces of the carrier, respectively, each of the dielectric bodies having a wiring layer embedded therein and a conductive layer formed on the wiring layer, and removing the carrier. Therefore, the wiring layers, the conductive layers and the dielectric bodies are formed on the two surfaces of the carrier, respectively, and the production yield is thus increased. The present invention further provides the package structure thus fabricated.

主权项

1. A package structure, comprising:
a carrier having two opposing surfaces; and two dielectric bodies formed on the two surfaces of the carrier, respectively, each of the dielectric bodies having a first wiring layer embedded therein and a first conductive layer formed on the first wiring layer.