WIRE BONDING STRUCTURE AND METHOD THEREOF

摘要

Disclosed is a wire bonding structure of a semiconductor package. The wire bonding structure is a wire bonding structure which connects a number of leads formed on a surface of a substrate and a number of input/output pads of a semiconductor chip electrically using a conductive wire. One end of a number of conductive wires is bonded to different input/output pads by ball bonding, and the other end of the conductive wires is bonded in a multi-layer structure by being bonded to one stitch position formed on one lead surface by stitch bonding. The objective of the present invention is to provide the wire bonding structure and the method thereof which can bond at least two conductive wires to one lead which is fine-pitched, without increase of lead length.