发明名称 電子部品実装システムおよび電子部品実装方法
摘要 An electronic component mounting system includes: a printing apparatus; a plurality of electronic component mounting apparatuses; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic component mounting apparatuses. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for each of the electronic component mounting apparatuses by referring to the mounting information.
申请公布号 JP5895131(B2) 申请公布日期 2016.03.30
申请号 JP20120280663 申请日期 2012.12.25
申请人 パナソニックIPマネジメント株式会社 发明人 伊藤 克彦;小宮 信夫
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
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