| 摘要 |
(Object) The present invention provides a radiation-sensitive resin composition for forming a film capable of being patterned and having excellent reliability, a polyimide film, a semiconductor device, and an organic EL device. (Solution) The radiation-sensitive resin includes [A] a polyimide precursor having a constituent unit represented by Formula (1) and [B] a mineral acid generator. In Formula (1), A represents a tetravalent organic group, and B represents a divalent organic group. X^1^ and X^2^ are a group represented by the following Formula (2). A patterned polyimide film is formed by using the radiation-sensitive composition and is used in a semiconductor device or an organic EL device. |
