| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting ink composition that forms a cured film having excellent insulation properties, good adhesion to plated copper and the like, good resistance to an alkali aqueous solution and the like, and low water absorbability.SOLUTION: The thermosetting ink composition includes at least one amic acid selected from an amic acid represented by formula (A1), an amic acid represented by formula (A2), and a specific polyamic acid having a crosslinkable organic group at the molecular end. In formulae (A1) and (A2), Ris a residue of a diamine (a1) derived from a dimer acid, and Ris a 2-100C bivalent crosslinkable organic group. |
