| 发明名称 | Semiconductor manufacturing apparatus | ||
| 摘要 | A semiconductor device manufacturing apparatus for encapsulating with a resin a semiconductor chip. A lead frame on which the semiconductor chip is mounted is provided between an upper mold and a lower mold. A tapered positioning pin is provided to the lower mold and includes a columnar portion having an outer diameter larger than an inner diameter of a positioning hole provided at an upper surface of the lead frame and configured to receive the columnar portion of the tapered positioning pin. Ejector pins are disposed in proximity to the tapered positioning pin at a distance determined by a thickness of the lead frame. The ejector pins are arranged so as to be symmetrical with respect to the tapered positioning pin. | ||
| 申请公布号 | US9296142(B2) | 申请公布日期 | 2016.03.29 |
| 申请号 | US201414494664 | 申请日期 | 2014.09.24 |
| 申请人 | SEIKO INSTRUMENTS INC. | 发明人 | Terui Yasuo;Akino Masaru |
| 分类号 | B29C45/14;H01L21/56;B29C45/40;B29L31/34 | 主分类号 | B29C45/14 |
| 代理机构 | Adams & Wilks | 代理人 | Adams & Wilks |
| 主权项 | 1. In combination with a lead frame on which a semiconductor chip is mounted, a semiconductor device manufacturing apparatus for encapsulating the semiconductor chip with a resin, the semiconductor device manufacturing apparatus comprising: an upper mold and a lower mold between which the lead frame is mounted; a tapered positioning pin provided to the lower mold, the tapered positioning pin including a columnar portion having an outer diameter larger than an inner diameter of a positioning hole provided at an upper surface of the lead frame and configured to receive the columnar portion of the tapered positioning pin; and a plurality of ejector pins disposed in proximity to the tapered positioning pin at a distance determined by a thickness of the lead frame, the plurality of ejector pins being arranged so as to be symmetrical with respect to the tapered positioning pin. | ||
| 地址 | JP | ||