LIQUID EJECTION HEAD SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF PROCESSING SILICON SUBSTRATE

摘要

The wall of each supply path formed in a silicon substrate has such a shape that a plurality of regions distinguished from each other due to different inclinations to a first surface of the silicon substrate are connected to each other between the first surface and a second surface of the silicon substrate and the width of the supply path is maintained or expands from the first surface to second surface of the silicon substrate. An internal opening is formed by one of the regions that is most steeply inclined to the first surface of the silicon substrate. A region reducing the squeezing of an adhesive into the internal opening is placed between the internal opening and the second surface of the silicon substrate.

主权项

1. A liquid ejection head substrate having a first surface and a second surface opposite to the first surface, comprising:
a plurality of ejection energy-generating elements placed on the first surface, the liquid ejection head substrate having a plurality of supply paths, extending between the first and second surfaces, for supplying liquid to the ejection energy-generating elements, wherein the distance between the centers of the neighboring supply paths in the first surface is 1 mm or less; the wall of each supply path has a cross-sectional shape which is perpendicular to the first surface, in which a plurality of regions distinguished from each other due to different inclinations to the first surface are connected to each other between the first and second surfaces, and in which the width of the supply path is maintained or expands from the first surface toward the second surface; and the supply path has an internal opening formed by one of the regions that is most steeply inclined to the first surface and a mechanism, located between the second surface and one of the regions that is most steeply inclined, reducing the squeezing of an adhesive into the internal opening.