BONDING DEVICE, BONDING SYSTEM, BONDING METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To perform bonding of substrates appropriately, by holding the substrates appropriately when bonding them.SOLUTION: A bonding device 41 has an upper chuck 140 for suction holding an upper wafer Wto the lower surface by vacuuming, and a lower chuck 141 provided below the upper chuck 140, and suction holding a lower wafer Wto the upper surface by vacuuming. The lower chuck 141 has a body 190 for vacuuming the lower wafer W, a plurality of pins 191 provided on the body 190 in contact with the back of the plurality of pins 191, and a plurality of non-contact ribs 193-196 provided concentrically and annularly on the outer periphery of the body 190. A plurality of pins 191 are provided between adjoining non-contact ribs 193-196.SELECTED DRAWING: Figure 6