| 摘要 |
The invention provides a processing method which prevents scraps of a protection tape from being left on wafers while cutting the protection tape by using a turning tool. The processing method comprises: a protection-tape bonding step in which a protection tape (7) is bonded to an object to be processed (1); a holding step in which the object to be processed is held by a holding workbench (21) with the protection tape (7) exposed after the bonding step is implemented; a flattening step in which a rotating turning tool wheel (35) is positioned at a preset height and the holding workbench (21) and the turning tool wheel (35) are moved relatively after the holding step is implemented, thereby performing cutting on the protection tape (7) bonded on the object to be processed (1) by using the turning tool wheel (35) and realizing the flattening, wherein in the flattening step, the rotation speed of the turning tool wheel (35) is configured to be a linear speed of 1914 m/min. Thus, the scraps of the protection tape are prevented from being left on the object to be processed. |
