Ultrasound transducer assembly and method of manufacturing the same

摘要

The present invention relates to an ultrasound transducer assembly (100) comprising ultrasound transducer elements (175, 175a) for transmitting ultrasound waves in a general transmission direction (A). Each of or each of part of the ultrasound transducer elements (175, 175a) comprises a piezoelectric layer (110, 110a) having a top surface, a bottom surface and a side surface with respect to the general transmission direction (A), as well as a bottom electrode layer (111, 111a) and a top electrode layer (112, 112a). A conductive layer (125) is applied at least partly on the side surface of at least one specific one (110a) of the piezoelectric layers, such that the conductive layer (125) is connected to the top electrode layer (112a) and the bottom electrode layer (111a) of said specific piezoelectric layer (110a).

主权项

1. An ultrasound transducer assembly comprising at least one row of ultrasound transducer elements for transmitting ultrasound waves in a general transmission direction comprising:
a semiconductor chip; andthe ultrasound transducer elements of the row each comprising:
a piezoelectric layer having a top surface, a bottom surface and a side surface with respect to the general transmission direction; a bottom electrode layer located on the bottom surface which is electrically coupled to the semiconductor chip; and a top electrode layer located on the top surface and facing the general transmission direction; a conductive connection layer electrically coupling the top electrode layers of the elements of the row, wherein a conductive layer is applied on the side surface of the piezoelectric layer of at least one of the elements of the row, such that the conductive layer electrically couples the top electrode layer and the bottom electrode layer of the element, wherein the bottom electrode layer of the at least one of the elements electrically couples the conductive connection layer to the semiconductor chip.