| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a holding table capable of suppressing cost more than before even in the case of holding a plurality of holding tables in accordance with the depth of a circular concave part of a wafer and improving workability that occurs during exchanging the holding tables. <P>SOLUTION: A holding table 2 holding a wafer having a circular concave part formed on a rear face and an annular reinforcement part for surrounding the circular concave part includes: a hat-shaped base 4 which has a cylindrical rising part 12 with a concave part holding part 10 for being fitted into the circular concave part to hold the circular concave part formed on an upper edge, and a spacer support part 8 for surrounding the circumference of the cylindrical rising part and whose one end communicates with the concave part holding part 10 and the other end has a first suction path; and an annular spacer 6 mounted detachably on the spacer support part 8 of the hat-shaped base 4 to have an opening into which the cylindrical rising part 12 is fitted. The thickness of the annular spacer 6 is set on the basis of a value obtained by subtracting the depth of the circular concave part of the wafer from the thickness of the cylindrical rising part 12 of the hat-shaped base 4. <P>COPYRIGHT: (C)2013,JPO&INPIT |
