SEMICONDUCTOR PACKAGE AN AND METHOD OF FABRICATING THE SAME

摘要

The present invention provides a semiconductor package and a method for manufacturing the same. The semiconductor package may include: a first semiconductor chip mounted on a substrate; a second semiconductor chip mounted on an upper plane of the first semiconductor chip; a connection bump which is intervened between the first semiconductor chip and the second semiconductor chip, and connects the second semiconductor chip to the first semiconductor chip electrically; and a thermal pad which is arranged on the upper plane of the first semiconductor chip, and is separated from a lower plane of the second semiconductor chip. The objective of the present invention is to provide the reliable semiconductor package, by improving heat radiation of the semiconductor chip.