DIE BONDER AND BONDING METHOD

摘要

The present invention is to provide a die bonder and a bonding method which can perform cleaning of a collet capable of removing foreign substances with strong adhesion certainly without scattering the foreign substances. The present invention relates to the die bonder and the bonding method which pick up a die from a wafer, and bond the die to a substrate, and clean an adsorption surface by moving the adsorption surface of the collet adsorbing the die and a metal brush having a line diameter of 10 to several hundreds μm along the adsorption surface relatively to the adsorption surface.