发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE |
摘要 |
There is provided a technology by which the position of 1 pin in a tabless package can be recognized easily. The rear surfaces of plural leads are exposed on a rear surface of a resin-sealed body which seals a semiconductor chip etc., a image recognition area is further provided adjacent to 1 pin (lead with index 1), and a rear surface of an identification mark is exposed from the rear surface of the resin-sealed body of the image recognition area. This identification mark is made of the same conductive member as the plural leads. |
申请公布号 |
US2016079186(A1) |
申请公布日期 |
2016.03.17 |
申请号 |
US201514953397 |
申请日期 |
2015.11.29 |
申请人 |
Renesas Electronics Corporation |
发明人 |
NARITA Hiroaki |
分类号 |
H01L23/00;H01L21/56;H01L21/683;H01L23/29;H01L23/544;H01L23/495;H01L23/31;H01L21/48;H01L21/78 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Tokyo JP |