发明名称 METHOD OF MANUFACTURING THREE-DIMENSIONAL CIRCUIT BY LASER ENGRAVING
摘要 PROBLEM TO BE SOLVED: To solve not only such a problem in a conventional manufacturing method that the material cost of a base material is high, but also such a problem that the process time required for laser engraving of a circuit pattern region is long.SOLUTION: A method of manufacturing a three-dimension circuit by laser engraving includes a step for providing a plastic base material, a step for bonding a metal layer to the surface of the plastic base material by a system for forming a metal plating film, a step for forming a circuit pattern on the metal plating film by laser engraving system, and a step for building the circuit pattern, as a three-dimension circuit, by electroplating system. Consequently, the effects of saving the time and material cost required for the process are obtained in the manufacturing of a three-dimensional circuit.SELECTED DRAWING: Figure 1
申请公布号 JP2016035998(A) 申请公布日期 2016.03.17
申请号 JP20140159143 申请日期 2014.08.05
申请人 KAHO KAGI KOFUN YUGENKOSHI 发明人 LIU WEI LIN
分类号 H05K3/08;H05K3/00 主分类号 H05K3/08
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