WIRING BOARD PROVIDED WITH THROUGH ELECTRODE, METHOD FOR MANUFACTURING SAME AND SEMICONDUCTOR DEVICE

摘要

A manufacturing method for forming a wiring board provided with a through electrode includes steps of: a step for forming, to a first layer, a wiring layer and a portion for a land where the through electrode is provided, the wiring and the portion for the land being formed in glass; a step for forming a metal layer on only a front surface of the glass; a step for forming a through hole in the glass only at a portion between the land where the through electrode of the back surface is provided and the land corresponding to the front surface thereof; a step for filling the through hole with a conductive material; a step for forming a metal layer on the back surface; and a step for polishing the metal layer on the front and back surfaces of the glass until a glass surface is exposed.

主权项

1. A wiring board provided with a through electrode, comprising:
a wiring board that is multi-layered, having glass as a base material, and having a through electrode provided in the glass, and, a wiring layer, wherein the wiring layer and the through electrode are provided in a first layer of front and back surfaces of the base material and are formed in the glass.