| 发明名称 |
SYSTEMS AND METHODS FOR ANALYZING A BONDLINE |
| 摘要 |
A method for analyzing a bondline in a structure is provided. The method includes obtaining, from a first side of the structure, by at least one computing device, at least one first internal image of the structure that includes at least a first pattern associated with the bondline, wherein the structure is in a pre-loaded state and obtaining, from the first side of the structure, by the at least one computing device, at least one second internal image of the structure that includes at least the first pattern, wherein the structure is in a loaded state. Additionally, the method includes comparing, by the at least one computing device, the at least one first internal image with the at least one second internal image, and determining, by the at least one computing device, at least one stress and/or strain-related property of the bondline based on the comparison. The method additionally includes predicting an estimated life of the bondline, whereby the estimated life provides a valuable tool for optimization of maintenance effort and enabling cost-optimal maintenance decisions. |
| 申请公布号 |
US2016078607(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201414486461 |
申请日期 |
2014.09.15 |
| 申请人 |
THE BOEING COMPANY |
发明人 |
Georgeson Gary E.;Poudel Anish;Chu Tsuchin;Grossnickle James A. |
| 分类号 |
G06T7/00 |
主分类号 |
G06T7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for analyzing a bondline in a structure, the method is implemented by at least one computing device, the method comprising:
obtaining, from a first side of the structure, by the at least one computing device, at least one first internal image of the structure that includes at least a first pattern associated with the bondline, wherein the structure is in a pre-loaded state; obtaining, from the first side of the structure, by the at least one computing device, at least one second internal image of the structure that includes at least the first pattern, wherein the structure is in a loaded state; comparing, by the at least one computing device, the at least one first internal image with the at least one second internal image; determining, by the at least one computing device, at least one stress and/or strain-related property of the bondline based on the comparison; and predicting an estimated life of the bondline, whereby the estimated life provides a valuable tool for optimization of maintenance effort and enabling cost-optimal maintenance decisions. |
| 地址 |
Huntington Beach CA US |
