发明名称 Substrate treatment system, substrate transfer method, and a non-transitory computer storage medium
摘要 In a coating and developing treatment system including a treatment station and an interface station, the interface station has: a cleaning unit cleaning a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting whether the cleaned wafer is in an exposable state; and a wafer transfer mechanism including an arm transferring the wafer between the cleaning unit and the inspection unit. Each of the cleaning unit and the inspection unit is provided at multiple tiers in an up and down direction on the front side in the interface station, and the wafer transfer mechanism is provided in a region adjacent to the cleaning units and the inspection units.
申请公布号 US9287145(B2) 申请公布日期 2016.03.15
申请号 US201213663179 申请日期 2012.10.29
申请人 Tokyo Electron Limited 发明人 Nakaharada Masahiro;Sakata Yoji;Miyata Akira;Hayashi Shinichi;Enokida Suguru;Nakashima Tsunenaga
分类号 H01L21/67;H01L21/677;H01L21/687 主分类号 H01L21/67
代理机构 Posz Law Group, PLC 代理人 Posz Law Group, PLC
主权项 1. A substrate treatment system comprising a treatment station in which a plurality of treatment units each treating a substrate, and an interface station in a casing which is located between said treatment station and an exposure apparatus, the interface station delivering the substrate between said treatment station and an exposure apparatus provided outside the casing, said interface station comprising: a cleaning unit that cleans at least a rear surface of the substrate; an inspection unit that inspects at least the rear surface of the cleaned substrate; a substrate transfer mechanism including an arm that transfers the substrate between said cleaning unit and said inspection unit; a buffer housing part that temporarily houses the substrate which has been inspected in said inspection unit; and a substrate transfer control part, the substrate transfer control part is configured to control the cleaning unit to clean at least the rear surface of the substrate,control the substrate transfer mechanism to transfer the substrate from said cleaning unit into said inspection unit;control the inspection unit to inspect at least the rear surface of the cleaned substrate transferred from the cleaning unit, to determine from a result of the inspection by the inspection unit whether the substrate is in an exposable state that allows exposure in the exposure apparatus, and when it is determined that the substrate is not in the exposable state to determine from the result of the inspection whether the substrate becomes the exposable state by re-cleaning;control the substrate transfer mechanism to transfer the substrate which is inspected to the buffer housing part before transferring the substrate based on the result of the inspection by the inspection unit;when it is determined from the result of the inspection that the state of the substrate is in the exposable state, control said substrate transfer mechanism to transfer the substrate to the exposure apparatus,when it is determined from the result of the inspection that the state of the substrate becomes the exposable state by re-cleaning, control said substrate transfer mechanism to transfer the substrate again to said cleaning unit and control the cleaning unit to re-clean at least the rear surface of the substrate,when it is determined from the result of the inspection that the state of the substrate does not become the exposable state by re-cleaning, stop the treatments on the substrate, and control the substrate transfer mechanism to facilitate collecting the substrate; the cleaning unit, the inspection unit, and the buffer housing part are arranged in the same casing which is located between the treatment stations and the exposure apparatus, wherein each of said cleaning unit and said inspection unit is provided at multiple tiers in an up and down direction on either a front side or a back side in said interface station, and wherein said substrate transfer mechanism is provided in a region adjacent to said cleaning units and said inspection units provided at multiple tiers in the up and down direction.
地址 Tokyo JP