PACKAGE STRUCTURES AND METHODS OF FORMING

摘要

Discussed are a package forming method and a structure. According to an embodiment of the present invention, the method includes the following steps: forming a back side redistribution structure; and adhering a first integrated circuit die to the back side redistribution structure after forming the back side redistribution structure. The method of the present invention further includes the following steps: encapsulating the first integrated circuit die on the back side redistribution structure with an encapsulant; forming a front side redistribution structure on the encapsulant; and electrically coupling a second integrated circuit die to the first integrated circuit die. The second integrated circuit die is electrically coupled to the first integrated circuit die through a first external electrical connector which is mechanically attached to the front side redistribution structure.