发明名称 Implementations of twisted differential pairs on a circuit board
摘要 A twisted differential conductor pair is formed on a circuit board that includes first-third conductors. The second conductor includes first-third portions. The second portion of the second conductor extends between an end of the first conductor and an end of the third conductor, and couples an end of the first portion of the second conductor to an end of the third portion of the second conductor. A solder mask layer is formed over the first, second, and third conductors on the circuit board. An end of the first conductor and the end of the third conductor are exposed through the solder mask layer. The exposed end of the first conductor is coupled to the exposed end of the third conductor over the solder mask layer with a bridge. This configuration may be repeated to create multiple twists along the twisted differential conductor pair.
申请公布号 US9288893(B2) 申请公布日期 2016.03.15
申请号 US200912537430 申请日期 2009.08.07
申请人 Broadcom Corporation 发明人 Karikalan Sampath Komarapalayam Velayudham
分类号 H05K1/00;H05K3/10;H05K1/02 主分类号 H05K1/00
代理机构 Fiala & Weaver P.L.L.C. 代理人 Fiala & Weaver P.L.L.C.
主权项 1. A circuit board, comprising: an electrically insulating layer; a first conductor, a second conductor, and a third conductor on the electrically insulating layer, the second conductor having a first portion, a second portion, and a third portion, and the second portion of the second conductor extending between an end of the first conductor and an end of the third conductor and coupling an end of the first portion of the second conductor to an end of the third portion of the second conductor; an electrically insulating solder mask layer patterned with openings on the electrically insulating layer over the first, second, and third conductors, the solder mask layer including a solder mask material and being an outermost layer of a stack of layers comprising each layer of the circuit board; and an electrically conductive bridge on the solder mask layer that is coupled through a first patterned opening in the solder mask layer to the end of the first conductor and through a second patterned opening in the solder mask layer to the end of the third conductor, and being outside of the stack of layers of the circuit board.
地址 Irvine CA US