发明名称 Semiconductor device and process for producing the same
摘要 A semiconductor device having a contact structure is provided. The semiconductor device includes: a conductive region; a first film and a second film which are formed over the conductive region to realize a layer; and a contact electrode which extends through the layer to the conductive region, and is formed so as to replace a portion of the layer with a portion of the contact electrode, where the portion of the layer is constituted by only the first film, only the second film, or both of a portion of the first film and a portion of the second film, and the portion of the first film occupies a major part of the portion of the layer.
申请公布号 US9287168(B2) 申请公布日期 2016.03.15
申请号 US201414259186 申请日期 2014.04.23
申请人 FUJITSU SEMICONDUCTOR LIMITED 发明人 Morioka Hiroshi;Ogura Jusuke;Pidin Sergey
分类号 H01L21/44;H01L21/768;H01L21/8238;H01L29/78 主分类号 H01L21/44
代理机构 Fujitsu Patent Center 代理人 Fujitsu Patent Center
主权项 1. A producing method of a semiconductor device, comprising: forming a first transistor and a second transistor in a first well of a first conductive type and a second well of a second conductive type, respectively, the first well and the second well being formed in a semiconductor substrate, the first transistor and the second transistor including a gate electrode successively formed over the first well and the second well; forming a first film and a second film over the first transistor and the second transistor, respectively, a boundary region between the first film and the second film being placed out of a boundary between the first well and the second well to the first well and placed over the first well of the first well and the second well; forming a contact hole placed out of the boundary region between the first film and the second film to the second film and extending to the gate electrode through the second film of the first film and the second film; and forming a contact electrode in the contact hole.
地址 Yokohama JP