INTERPOSER AND SEMICONDUCTOR PACKAGE WITH NOISE SUPPRESSION FEATURES

摘要

Interposer and semiconductor package embodiments provide for the isolation and suppression of electronic noise such as EM emissions in the semiconductor package. The interposer includes shield structures in various embodiments, the shield structures blocking the electrical noise from the noise source, from other electrical signals or devices. The shields include solid structures and some embodiments and decoupling capacitors in other embodiments. The coupling structures includes multiple rows of solder balls included in strips that couple the components and surround and contain the source of electrical noise.

主权项

1. An interposer for connecting a semiconductor die to a printed circuit board, said interposer comprising:
a substrate body having opposed first and second surfaces; a plurality of conductive layers disposed in a dielectric material on said substrate body, wherein one of said conductive layers includes a first metal lead and a further of said conductive layers includes a second metal lead, wherein said first metal lead is shielded from said second metal lead by a shield including portions of at least one interposed conductive layer of said conductive layers; said first metal lead extending along a longitudinal direction of said interposer and said shield extending continuously laterally across at least a majority of a transverse direction of said interposer between said first and second metal leads; and wherein said conductive layers are formed of metal materials or semiconductor materials.