LIGHT EMITTING DEVICE

摘要

A light emitting device includes a substrate having a top surface, upper and lower metal layers, multiple LED chips, at least one Zener diode, multiple conductive wires and an encapsulant. The top surface includes a central region bounded by an imaginary boundary with a profile conforming to an outline of a circle stacked with a polygon. The central region has a die bonding area corresponding to the circle, and at least one polygonal extension area formed outside the die bonding area. The upper metal layer includes multiple conducting pads surrounding the central region. The LED chips are disposed on the die bonding area. The Zener diode is disposed on the polygonal extension area. The encapsulant is disposed on the substrate and covers the LED chips.

主权项

1. A light emitting device, comprising:
a substrate that has opposite top and bottom surfaces, said top surface including a central region that is bounded by an imaginary boundary with a profile substantially conforming to an outline of a circle in combination with a polygon stacked on said circle, said central region having a substantially circular die bonding area that corresponds to said circle, and at least one polygonal extension area that is formed outside said circular die bonding area by an intersection of said circle with a corner part of said polygon; an upper metal layer that includes a conducting pad assembly including at least one first conducting pad and at least one second conducting pad, said first and second conducting pads being disposed on said top surface of said substrate and surrounding said central region; a lower metal layer that includes a soldering pad assembly including at least one first soldering pad and at least one second soldering pad, said first and second soldering pads being disposed on said bottom surface of said substrate and being electrically connected to said first and second conducting pads, respectively; a plurality of LED chips that are disposed on said substantially circular die bonding area of said central region; at least one Zener diode that is disposed on said at least one polygonal extension area of said central region; a plurality of conductive wires that electrically interconnect said LED chips, said at least one Zener diode, said at least one first conducting pad and said at least one second conducting pad to form at least one conducting loop; and an encapsulant that is disposed on said top surface of said substrate and that covers said LED chips.