发明名称 |
METHODS AND SYSTEMS FOR INSPECTION OF WAFERS AND RETICLES USING DESIGNER INTENT DATA |
摘要 |
Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
|
申请公布号 |
US2008081385(A1) |
申请公布日期 |
2008.04.03 |
申请号 |
US20070939983 |
申请日期 |
2007.11.14 |
申请人 |
MARELLA PAUL F;MCCAULEY SHARON;CHANG ELLIS;VOLK WILLIAM;WILEY JAMES;WATSON STERLING;KEKARE SAGAR A;HESS CARL |
发明人 |
MARELLA PAUL F.;MCCAULEY SHARON;CHANG ELLIS;VOLK WILLIAM;WILEY JAMES;WATSON STERLING;KEKARE SAGAR A.;HESS CARL |
分类号 |
H01L21/66;G01N21/95;G03F1/00;G03F7/20 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|