APPARATUS FOR PACKING BARE CHIP

摘要

Disclosed is an apparatus to package a bare chip which picks up the bare chip one by one and then places sequentially the bare chip into a plurality of pockets, and then closes the pockets. The disclosed bare chip packaging apparatus comprises: a carrier film supply unit which continuously supplies a carrier film where a number of pockets are arranged in an equal interval along a longitudinal direction; a carrier film collection unit which collects the carrier film discharged from the carrier film supply unit; a carrier film feeding unit which transfers the carrier film discharged from the carrier film supply unit to the carrier film collection unit; a wafer stage which supports a bare chip wafer where a plurality of bare chips is arranged on an equal plane; a bare chip pickup and loading unit which picks up the bare chip from the wafer stage, and loads the bare chip by dropping the bare chip on the pocket of the carrier film moving between the carrier film supply unit and the carrier film collection unit; and a pocket sealing unit which covers and seals the pocket loaded with the bare chip. The apparatus performs continuously a winding work for a flexible film in a roll type.