AN ANISOTROPIC CONDUCTIVE FILM AND A SEMI-CONDUCTIVE DEVICE CONNECTED BY THE FILM

摘要

The present invention relates to an anisotropic conductive film which has less than or equal to 30% change in modulus of the film after storing the film at 25°C for 170 hours, and an onset temperature of 60 to 85°C in differential scanning calorimetry (DSC). The change in modulus can be obtained by a formula: percentage of modulus change (%) = {(M_1-M_0)/M_0} X 100. In the formula: M_0 represents a modulus value (kgf/cm^2) of the anisotropic conductive film measured at 25°C at time 0; M_1 represents a modulus value (kgf/cm^2) of the anisotropic conductive film after leaving the film at 25°C for 170 hours. The anisotropic conductive film of the present invention has improved storage stability, moisture resistance, thermal resistance, and film formation while achieving rapid curing at low temperatures using thermal curing. The anisotropic conductive film comprises: an epoxy resin including a hydrogenated epoxy resin; a cationic polymerization catalyst represented by chemical formula 1; and a compound represented by chemical formula 2.