发明名称 Structures and methods for testing integrated circuits and via chains therein
摘要 An exemplary structure for testing an integrated circuit includes a semiconductor substrate and first and second via chains disposed over the substrate. The via chains include a substantially same sequence of segments interconnected at N via regions by a respective first and second via arrangement. The first via arrangement includes MN first vias at each respective via region and the second via arrangement includes MN+KN second vias at each respective via region. The first via arrangement is different than the second via arrangement and KN≧1 for at least one via region. The structure includes a voltage sensing apparatus in electrical connection with each via chain and configured to drive a first constant current through the first via chain and to drive a second constant current through the second via chain to measure a differential voltage between the via chains.
申请公布号 US9279851(B2) 申请公布日期 2016.03.08
申请号 US201313875962 申请日期 2013.05.02
申请人 GLOBALFOUNDRIES, INC. 发明人 Csaszar Farkas Marton
分类号 G01R31/02;G01R31/28;H01L21/66 主分类号 G01R31/02
代理机构 Ingrassia Fisher & Lorenz, P.C. 代理人 Ingrassia Fisher & Lorenz, P.C.
主权项 1. A structure for testing an integrated circuit comprising: a semiconductor substrate; a first via chain disposed over the semiconductor substrate, wherein the first via chain includes a first sequence of segments interconnected at N via regions by a first via arrangement, wherein the first via arrangement includes MN first vias at each respective via region in the first via chain; a second via chain disposed over the semiconductor substrate, wherein the second via chain includes a second sequence of segments interconnected at N via regions by a second via arrangement different from the first via arrangement, wherein the second via arrangement includes MN+KN second vias at each via region in the second via chain, wherein KN≧1 for at least one via region, and wherein the second sequence of segments is substantially the same as the first sequence of segments; and a voltage sensing apparatus in electrical connection with each via chain and configured to drive a first constant current through the first via chain and to drive a second constant current through the second via chain to measure a differential voltage between the via chains.
地址 Grand Cayman KY