SPACER BEING CAPABLE FOR REFLOW-SOLDERING BY SURFACE MOUNT

摘要

Disclosed is a spacer capable of reflow-soldering through surface mounting comprising: a heat-resistant body where a bridge is formed and extended in the middle of the longitudinal direction or in the same direction on both ends, and a pick-up surface is formed for performing a vacuum pick-up process on at least a portion of an upper surface; a projection unit for fixing a position protruding from a bottom surface of the body; and a soldering unit formed on the bottom surface of the body. The purpose of the present invention is to provide the spacer which is endurable when strong force is applied in a high temperature.