| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure capable of improving heat dissipation efficiency and also to provide an electronic apparatus equipped with the same.SOLUTION: In a heat dissipation structure, an auxiliary heat radiation part (a rib or an inner wall of a recess) is included which is provided in a bulge part 8 of a center frame 2 and comes into contact with the whole or a part of circumference of a side surface of a heat dissipation sheet 7 arranged between an electronic component 6 and the bulge part 8.SELECTED DRAWING: Figure 4 |
