| 摘要 |
PROBLEM TO BE SOLVED: To enhance long term joint reliability at a joint of a joining layer composed of a sintered layer of copper and an electrode formed of Au or other metal.SOLUTION: In a joining material containing cupric oxide, a hydrate of copper salt, and a solvent, the thermal decomposition temperature of the hydrate of copper salt is set lower than the reduction temperature of the cupric oxide. An electronic component has two electrodes, and a joining layer connecting them electrically. The joining layer includes a sintered layer of copper, and at least one of two electrodes has a region where copper is diffused from the interface with the joining layer. In the joining method, a part to be joined is coated with a joining material containing cupric oxide, a hydrate of copper salt, and a solvent, and then heated so that the copper salt is thermally decomposed and the cupric oxide is reduced to form a joining layer.SELECTED DRAWING: Figure 12 |
