| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method which can be performed at low cost.SOLUTION: A substrate processing method has a support process of bonding a support substrate 20 to a processed substrate 10 and a process of delaminating the support substrate 20. The support process includes: a process of forming a protection layer 13 on a surface of the processed substrate 10; a process of forming on or under a surface of the support substrate 20, an adhesion layer 21 having groove-shaped recesses 22 having closed ends; a process of opposing the processed substrate 10 where the protection layer 13 is formed and the support substrate 20 where the adhesion layer 21 is formed, and contacting the protection layer 13 and the adhesion layer 21 to form a bonded substrate 30 by bonding the processed substrate 10 and the support substrate 20 via the protection layer 13 and the adhesion layer 21. The delamination process includes a process of immersing the bonded substrate 30 in a stripping solution to osmose the stripping solution from a periphery 23 of the adhesion layer 21 to the groove-shaped recesses 22.SELECTED DRAWING: Figure 2 |
