METHOD FOR ELECTRONIC CIRCUIT ASSEMBLY ON A PAPER SUBSTRATE

摘要

A methodology for a thin, flexible substrate having integrated passive circuit elements, and the resulting device are disclosed. Embodiments may include integrating one or more passive circuit components on a first or second surface of a substrate, and interconnecting one or more integrated circuit (IC) dies on a second surface of the interposer to the one or more passive circuit components with one or more metal-filled vias between the first and second surfaces, the first and second surfaces being opposite surfaces of the substrate.

主权项

1. A method comprising:
integrating one or more passive circuit components on a first surface of a substrate; and interconnecting one or more integrated circuit (IC) dies on the first or a second surface of the substrate to the one or more passive circuit components with one or more metal-filled vias between the first and second surfaces, wherein the first and second surfaces are opposite surfaces of the substrate, and wherein the substrate is formed from a carbon-based or metal-based material different from silicon (Si) and FR4 and which has a coefficient of thermal expansion (CTE) matched to that of Si, and by depositing alumina or a multilayer dielectric that has low permeability to oxygen and moisture on a paper substrate, by atomic layer deposition (ALD).