发明名称 SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS FOR ELECTROMAGNETIC SHIELDING
摘要 The invention relates to a semiconductor component (10) comprising a casing, in the form of a moulding compound (18), which surrounds at least some regions of the semiconductor component (10), and comprising an electromagnetic shielding device (26) which surrounds at least some regions of the casing. According to the invention, the electromagnetic shielding device (26) is designed as a second moulding compound (25) having metallic particles.
申请公布号 WO2016030154(A1) 申请公布日期 2016.03.03
申请号 WO2015EP67946 申请日期 2015.08.04
申请人 ROBERT BOSCH GMBH 发明人 HOEFER, HOLGER;HENZLER, STEPHAN
分类号 H01L23/31;H01L21/56;H01L21/60;H01L23/29;H01L23/552 主分类号 H01L23/31
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