发明名称 |
SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS FOR ELECTROMAGNETIC SHIELDING |
摘要 |
The invention relates to a semiconductor component (10) comprising a casing, in the form of a moulding compound (18), which surrounds at least some regions of the semiconductor component (10), and comprising an electromagnetic shielding device (26) which surrounds at least some regions of the casing. According to the invention, the electromagnetic shielding device (26) is designed as a second moulding compound (25) having metallic particles. |
申请公布号 |
WO2016030154(A1) |
申请公布日期 |
2016.03.03 |
申请号 |
WO2015EP67946 |
申请日期 |
2015.08.04 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
HOEFER, HOLGER;HENZLER, STEPHAN |
分类号 |
H01L23/31;H01L21/56;H01L21/60;H01L23/29;H01L23/552 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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