| 摘要 |
A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a contact probe arranged at a side of the mounting table and electrically connected to a mounting table electrode of the mounting table. The contact probe includes a contact portion, having a top surface formed uneven, to be in contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion. The contact portion and the cable connection portion are vertically movable by a biasing member provided below the cable connection portion. When the probes are made contact with electrodes of a semiconductor device of the semiconductor wafer by moving up the mounting table, the contact portion and the electrode plate are made contact with each other and the backside electrode and the tester are electrically connected to each other. |
| 主权项 |
1. A probe device which is electrically connected to a semiconductor device formed on a semiconductor wafer and performs an electrical test of the semiconductor device by a tester, the probe device comprising:
a mounting table configured to mount thereon the semiconductor wafer; a mounting table electrode formed on a mounting surface of the mounting table on which the semiconductor wafer is mounted, the mounting table electrode being into contact with a backside electrode formed on a backside of the semiconductor device; a probe card arranged above the mounting table, the probe card having a plurality of probes electrically connected with the tester; a driving mechanism configured to drive the mounting table to make the probes contact with electrodes of the semiconductor device of the semiconductor wafer mounted on the mounting table; an electrode plate arranged above the mounting table and electrically connected with the tester; a contact probe arranged at a side of the mounting table; a stopper and guide block fixed to the side of the mounting table; and a base block provided protruding from a lower portion of the mounting table, wherein the contact probe includes a contact portion, having a top surface formed uneven, to be into contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion below the contact portion, a cable electrically connected to the mounting table electrode being connected to the cable connection portion, wherein the contact probe is locked to the base block through a probe guide block and a probe presser, wherein the contact probe is integrally formed from one metal material. wherein a gold-plated layer and an intermediate plated layer are formed on a surface of the contact probe, the intermediate plated layer being formed under the gold-plated layer. wherein the contact portion and the cable connection portion are configured to be vertically movable by a biasing member provided below the cable connection portion, and wherein when the probes are made contact with the electrodes of the semiconductor device by moving up the mounting table, the contact portion and the electrode plate are brought into contact with each other and the backside electrode and the tester are electrically connected to each other. |
