发明名称 EXPOSURE APPARATUS AND EXPOSURE METHOD, AND METHOD FOR MANUFACTURING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an exposure apparatus that can align a substrate with high accuracy and high throughput, and can align a wafer at an exposure position with high accuracy upon exposure.SOLUTION: In a detection operation of a mark by an alignment system (AL1, AL2to AL2), a controller controls a drive system of a stage WST in such a manner that, in order to detect a plurality of marks on a wafer W, which are at different positions with regard to a Y direction orthogonal to an X direction within an XY plane, in at least a part of detection regions of the alignment system (AL1, AL2to AL2), the wafer W is relatively moved in the Y direction with respect to a plurality of detection regions; and in an exposure operation on the wafer W, the controller uses detection information of the marks by the alignment system.SELECTED DRAWING: Figure 29
申请公布号 JP2016029490(A) 申请公布日期 2016.03.03
申请号 JP20150190799 申请日期 2015.09.29
申请人 NIKON CORP 发明人 SHIBAZAKI YUICHI
分类号 G03F7/20;G01B11/00;H01L21/68 主分类号 G03F7/20
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