| 摘要 |
PROBLEM TO BE SOLVED: To provide a silicon recovery method by which silicon with high purity can be effectively recovered from a waste liquid discharged in a cutting process of a silicon wafer.SOLUTION: A waste liquid A discharged in a cutting process of a silicon wafer is separated into a liquid B and cut chips C including an infinite number of silicon fine particles and abrasive grains, and the cut chips C are tightly sealed within a transparent case 4. The cut chips C are irradiated with sun light, which is collected by a solar light collector 5 arranged outside the case 4, through one face of the case 4 to be heated, thereby having the silicon fine particles separated from the cut chips C to be baked. |
