发明名称 半導体装置及び半導体装置の製造方法
摘要 An element using a semiconductor layer is formed between wiring layers and, at the same time, a gate electrode is formed using a conductive material other than a material for wirings. A first wiring is embedded in a surface of a first wiring layer. A gate electrode is formed over the first wiring. The gate electrode is coupled to the first wiring. The gate electrode is formed by a process different from a process for the first wiring. Therefore, the gate electrode can be formed using a material other than a material for the first wiring. Further, a gate insulating film and a semiconductor layer are formed over the gate electrode.
申请公布号 JP5876249(B2) 申请公布日期 2016.03.02
申请号 JP20110175391 申请日期 2011.08.10
申请人 ルネサスエレクトロニクス株式会社 发明人 砂村 潤;井上 尚也;金子 貴昭
分类号 H01L29/786;H01L21/28;H01L21/3205;H01L21/768;H01L21/822;H01L23/522;H01L27/04;H01L29/423;H01L29/49;H01L29/861;H01L29/868 主分类号 H01L29/786
代理机构 代理人
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