Accurate Positioning and Alignment of a Component During Processes Such as Reflow Soldering

摘要

One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the component during reflow soldering through surface tension/capillary forces of the solder paste material in the channels. Such channels also can be used, for example, by an image processing system to facilitate accurate positioning and/or alignment of the component. The image processing system can use the location of the channels alone, or in combination with other features such as a solder mask or other alignment marks, to position and/or align the component with high accuracy.

主权项

1. An apparatus comprising:
a substrate including a conductive layer over an insulating base layer, wherein the conductive layer includes one or more channels in its surface; and an electronic or optoelectronic component bonded to the conductive layer by a solder material, wherein the component is disposed at least partially over the one or more channels in the surface of the conductive layer.