| 摘要 |
A heat dissipation apparatus for a hard disk array. The apparatus comprises a substrate (1) and a first fixed plate (3) and a second fixed plate (4) provided on an upper surface of the substrate (1). The first fixed plate (3), the second fixed plate (4) and the substrate (1) form at least one hard disk slot. A hard disk (2) is placed in the hard disk slot. A connector is provided at a bottom surface of the hard disk (2). A first end surface (5) of the hard disk (2) is in contact with the first fixed plate (3), and a second end surface (6) of the hard disk (2) is in contact with the second fixed plate (4). A first heat conduction pipe (7) is provided in a region on the first fixed plate (3) which is in contact with the first end surface (5). A second heat conduction pipe (8) is provided in a region on the second fixed plate (4) which is in contact with the second end surface (6). A first heat dissipation fin (9) is provided at an outer side of the first fixed plate (3). A second heat dissipation fin (10) is provided at an outer side of the second fixed plate (4). One end of the first heat conduction pipe (7) is in contact with the first end surface (5) while the other end is in contact with the first heat dissipation fin (9). One end of the second heat conduction pipe (8) is in contact with the second end surface (6) while the other end is in contact with the second heat dissipation fin (10). |
